Global High Bandwidth Memory Market is estimated to witness a rise in revenue from US$ 233.4 Mn in 2021 to US$ 1,197 Mn by 2027. The market is registering growth at a CAGR of 31.3% during the forecast period 2022-2027. High bandwidth memory is a type of memory interface used in 3D-stacked DRAM (dynamic random-access memory) and in some AMD GPUs (aka graphics cards) as well as the server, high-performance computing (HPC), and networking and client space. It takes lower power consumption compared to the GDDR memory which is used in graphic cards for gaming. It accelerates high performance in graphics, network devices, data centers, and some computing systems. The growing adoption of 5G infrastructure, AI, and internet edge for next-generation networking will significantly drive the demand for high bandwidth memory. Moreover, the growing application of graphics, the appetite for the fast delivery of information (bandwidth) has further influenced the growth of the high bandwidth memory market.
Furthermore, the demand for high bandwidth memory is mainly driven by the rising need for better speed and greater bandwidth among industries and the increasing proliferation of cloud-based solutions. End-users such as consumer electronics, automotive, commercial sector are driving the need for greater interconnection that allow them and their customers to gain new efficiencies by scaling the digital capabilities of their IT infrastructure and reducing costs. Hence, the rising need for better speed and greater bandwidth among industries would propel the growth of the high bandwidth memory market during the forecast period. Moreover, the adaption of the cloud-based solution has been growing rapidly in businesses and more computing needs are driven by the advent of IoT and Big Data. Also, cloud-based solutions act as a key value-added function for several businesses including both large and small- and mid-sized enterprises (SMEs). Therefore, this significant increase in the adoption of cloud-based solutions has accelerated the requirement for high bandwidth memory and great network infrastructure, thereby accelerating the market expansion at a considerable rate. However, a complication associated with the error solving process is a restraining factor that is influencing the growth of the market over the forecast period.
Report Summary
The study of the global high bandwidth memory market considers various market determinants, industry value chain analysis, and competitor analysis of the market. The report discusses the analysis of the high bandwidth memory industry for the period 2017-2027, where the base year is 2021 and the forecast period is 2022-2027. The report provides a detailed analysis of the global high bandwidth memory market across 13 Chapters and 136 pages. The report includes data presentation across 27 tables and 65 statistical figures.
The report provides PESTLE analysis, which is a tool to examine the external market environment factors that have an impact on the industry. The PESTLE analysis examines the Political, Economic, Social, Technological, Environmental, and Legal factors in the external environment. Thus, sufficiently examining the threats and weaknesses of the industry. The research report also provides Porter’s five forces analysis wherein the bargaining power of buyers and competitive rivalry is high.
The subsequent section provides details of the market analysis based on different segments such as product, application, and region. The report includes a detailed study of the value chain of the industry. It includes raw material providers, manufacturing, distributors, and end-users. The report also covers extensively the key competitors in the market for high bandwidth memory market.
COVID-19 impact on Global High Bandwidth Memory Market
During the inception of the COVID-19 pandemic, the global demand for the high bandwidth memory market is significantly reduced due to low investments by government and private companies in bandwidth memory manufacturing, which leads to cutbacks in such business lines. Keeping up with the present changing challenging condition, the market situation of high bandwidth memory is being halted for the short term and has forced the government authorities and key manufacturers to stop or delay their manufacturing processes and investment in such manufacturing plants, to control the spread of the novel coronavirus disease. It further affects the business of its end-use industries who opt for such on account of its versatile benefits, which may pose a negative influence temporarily, amidst the pandemic. However, the increase in emerging technologies such as 5G, the Internet of Things, high-performance computing, and the intelligent edge is creating a lucrative growth opportunity for the high bandwidth memory market in the forthcoming years. Therefore, the high bandwidth memory market is expected to be a critical catalyst to the growth of emerging technologies.
Key Takeaways from the Global High Bandwidth Memory Market Report
Competitive Landscape
The key players in the Global High Bandwidth Memory Market are Advanced Micro Devices, Inc., SK Hynix Inc., Micron Technology, Inc., Rambus Inc., Xilinx, Inc., Open-Silicon, Inc., NEC Corporation, Cadence Design Systems, Inc., Intel Corporation, and Samsung Electronics Co., Ltd. among others. Through extensive research, it is found that big players have adopted various competitive strategies such as mergers & acquisitions in order to have a grip on the emerging markets. Furthermore, leading companies are expanding their geographical boundaries by acquiring small brands and domestic companies.
Segmentation Overview
Global High Bandwidth Memory Market is segmented based on product, application, and region. The industry trends in the global high bandwidth memory market are sub-divided into different categories in order to get a holistic view of the global marketplace.
Following are the different segments of the Global High Bandwidth Memory Market:
By Product segment of the Global High Bandwidth Memory Market is sub-segmented into:
By Application segment of the Global High Bandwidth Memory Market is sub-segmented into:
By Region segment of the Global High Bandwidth Memory Market is sub-segmented into:
Report Attribute | Details |
---|---|
Market Size Value in 2021 | US$ 233.4 Mn |
Expected Revenue in 2027 | US$ 1,197 Mn |
Historic Data | 2017-2020 |
Base Year | 2021 |
Forecast Period | 2022-2027 |
Unit | Value (USD Mn) |
CAGR | 31.3% |
Segments covered | By Product, Application, and Region |
Key Companies | Advanced Micro Devices, Inc., SK Hynix Inc., Micron Technology, Inc., Rambus Inc., Xilinx, Inc., and other prominent players. |
Customization Scope | Get your customized report as per your preference. Ask for customization |
High bandwidth memory plays a significant role in data centers, as it fuels analytics engines and help train the next wave of AI algorithms and also solve the challenges of storing, moving and analyzing data rapidly and efficiently.
Global High Bandwidth Memory Market is studied from 2017-2027.
The growth rate of global high bandwidth memory market is 31.3%, with an estimated value of US$ 1,197 Million by 2027.
North America held the major share in terms of revenue in the global high bandwidth memory market in 2021.
Factors such as rising need for better speed and greater bandwidth among industries and increasing proliferation of cloud-based solutions drives the growth in the global high bandwidth memory market.
Complications associated with error solving process is a restraining factor which inhibits the growth of the market during the forecast period.
Product, application and region are the different segments of the global high bandwidth memory market.
The data center application segment leads the market in 2021 due to the growing number of data center across the world coupled with increasing demand for fast delivery of information (bandwidth).
The HBM is better than the GDDR as it takes lower power consumption and provides substantially more bandwidth as compared to the GDDR memory which is used in graphic cards for gaming.
UK is expected to project the highest CAGR in the Europe High Bandwidth Memory Market during the forecast period.
End-users such as consumer electronics, automotive and commercial sectors are driving the need for greater interconnection in order to gain new efficiencies by scaling the digital capabilities of their IT infrastructure and reducing costs.
The key players operating in the market include Advanced Micro Devices, Inc., SK Hynix Inc., Micron Technology, Inc., Rambus Inc., Xilinx, Inc., Open-Silicon, Inc., NEC Corporation, Cadence Design Systems, Inc., Intel Corporation and Samsung Electronics Co., Ltd. among others.